銦（In）

規(guī)格：

      高純銦：99.999% In-5N-I-24

      檢測雜質(zhì)：Cu, Fe, Mg, Ni, Pb, Sn, Tl, Zn, Si, S

      雜質(zhì)總含量：≤10ppm

      高純銦：99.9999% In-6N-I-25

      檢測雜質(zhì)：Cd, Cu, Fe, Mg, Pb, S, Si, Sn

      雜質(zhì)總含量：≤1ppm

      高純銦：99.99999% In-7N-I-26

      檢測雜質(zhì)：Ag, Cd, Cu, Fe, Mg, Ni, Pb, Zn

     雜質(zhì)總含量：≤0.1ppm

用途：主要用于制備Ⅲ-Ⅴ族化合物半導體、高純合金以及ITO粉末。

包裝：滌綸薄膜包裝后雙層復合膜抽真空包裝外套復合鋁箔內(nèi)充氬氣封裝或直接玻璃管真空封裝。

Specification:
High purity In: 99.999% In-5N-I-24
Testing impurity: Cu, Fe, Mg, Ni, Pb, Sn, Tl, Zn, Si, S
Total impurity content: ≤10ppm
High purity In: 99.9999% In-6N-I-25
Testing impurity: Cd, Cu, Fe, Mg, Pb, S, Si, Sn
Total impurity content: ≤1ppm
High purity In: 99.99999% In-7N-I-26
Testing impurity: Ag, Cd, Cu, Fe, Mg, Ni, Pb, Zn
Total impurity content: ≤0.1ppm
Application: Used for preparation Ⅲ-Ⅴ elements chemical compound semiconductor, high purity metal, and ITO powder.
Package: Packed with terylene film, and double poly-film with vacuum encapsulation, then with aluminum foil with argon encapsulation. Packed with glass tube with vacuum encapsulation directly.